Composition and Classification of Copper-based Substrates
Copper-based substrates are copper-based materials that are widely used in electronics, optics and other fields. The following is detailed information about them:
Structural composition: They are generally composed of three layers, namely the circuit layer, the insulating layer and the metal base layer. The circuit layer usually adopts thicker copper foil with a thickness of 35μm-280μm to meet the requirements of high current carrying capacity; the insulating layer is the core technical part, whose core thermal conductive components are composed of alumina, silicon powder and epoxy resin-filled polymers, featuring low thermal resistance, excellent viscoelasticity and thermal aging resistance; the metal base layer is generally a copper plate, mainly serving the functions of heat dissipation, shielding, covering or grounding.
Classification: They are mainly divided into two types: embedded copper coin PCBs and buried copper coin PCBs. In addition, according to whether they have a multi-layer structure, they can also be classified into single-layer copper-based substrates and multi-layer copper-based substrates. Multi-layer copper-based substrates usually use two to three copper layers in the middle to enhance electrical conductivity.
