Complete Production Process Flow of Copper Base Plate (Copper Substrate)

The production of copper base plates takes vacuum lamination and precision etching as core technologies, covering the entire process from substrate preparation to finished product inspection. It focuses on solving three key issues: the bonding strength between copper material and insulation layer, thermal conductivity efficiency, and insulation reliability. The standard production process and key process points are as follows:

I. Pre-Production Preparation Stage

1. Substrate Selection and Preparation

Copper Base Layer Selection: 99.9% high-purity electrolytic copper (red copper) is adopted, with a thickness of usually 0.5–3 mm, customized according to power requirements.

Surface Pretreatment:

Mechanical polishing: Removes oxide layers and oil stains, and improves surface roughness.

Chemical cleaning: Alkaline degreasing → pickling → neutralization → drying, to ensure surface cleanliness.

Roughening treatment: Micro-etching to form a micro concave-convex structure, enhancing the bonding force with the insulation layer.

Insulation Layer Material: High thermal conductivity epoxy resin, polyimide or ceramic-filled materials are selected, with a thickness of 25–125 μm and thermal conductivity ≥ 3 W/(m·K).

2. Material Cutting and Dimensional Control

CNC cutting: Tolerance controlled at ±0.1 mm, with no burrs on edges.

Chamfering treatment: Prevents scratching of equipment in subsequent processes and operators.

Pre-baking treatment: Constant temperature baking at 120°C for 2–4 hours to remove internal stress and moisture from copper material.